Burst Pressures: Wafers 510, 511, 513
I recently tested the burst pressures of samples from W510, 511, and 513. None of the membranes are pinhole free. Silicon thickness varies (15 nm, 10 nm, 20 nm). See Dave’s post for complete fabrication information.
W513 has noticeably higher burst pressures compared to W510 and 511. Overall W510 is in the worse shape overall, having the most pinholes and few intact membranes. W513 is in the best condition of the three.



I guess this is the trend we expected to see. Keep in mind these three wafers were etched with the stainless cell that leeched iron spindles so that could be weakening the membranes…
The McGrath lab now has wafer 504 and 509 in their possession. Could someone pressure test these? Check with Jess/Tom before you start popping membranes out, though. These were etched in the new “old” etch cell.
It may also be worth trying various annealing treatments to try and reduce stress prior to pressure testing them. Maybe we could get some additional strength out of them..
I’m also curious about 504, since the edge does not look that great. We’ve got to get a better etch working soon…