New wafers permeabilty and burst pressures data

Last week, JP and I resurrected using TEOS as the backside pattern and experimented with using a thermal oxide as the first protective oxide layer (instead of a sputtered oxide).  The idea was to see how the reduced stress in the pattern (TEOS) would affect film morphology.  The thermal oxide on the frontside was an…

Over the past month, I’ve posted some results of a colorimetric assay for silicic acid.  Previous posts are here and here.  These results showed that the assay detected silicic acid after pnc-Si and PSi degraded.  However, bare silicon wafers also yielded silicic acid, according to this assay.  Since pnc-Si samples have the Si well-side surface,…

A while back, we discussed leaving the rotation stage off during the a-Si deposition to induce a thickness gradient over a single wafer.  The purpose of this experiment was to explore the different morphologies vs. thickness at a given RTP treatment.  We estimated that we could cover a 3x thickness range over a 8 cm…

I have just completed testing and documentation of a MATLAB GUI designed to allow anyone to make predictions of the clearance behavior of solutes though our membranes in tangential flow. I’m uploading the file here, which includes all the MATLAB code for the GUI, dependancies, and documentation. It will also appear under the resources tab on the…

I have been using MatLab to analyze the pores in the SC wafers. Here are the results from my analyses: To take a first look, I simply plotted four characteristics: average pore size, porosity, cut-off pore size, and mean roundness against the wafer number. Notice that the blue dots are the b wafers. Excel would…