W648: Burst Pressure and the Return of Contamination?
We received W648 from the production team this week. Upon inspection of this wafer, is has a higher density of pinholes than we have been seeing lately (>3 pinholes/slit compared to 0 or 1/slit) and seems to show a return of contamination, shown below. This contamination is visible over the entire wafer, but is easiest to see on the slits in the images below.
I also ran burst pressure tests, with a range of 2.18-3.01 PSI. The samples tested for BP all had pinholes; between 10-14/sample. These pinholes are quite small however, ~5um, so I doubt they contribute to the low burst pressures.



OK…this wafer was had a two-stage anneal with an initial temperature of 600C. It seems a first anneal of 400C gives us the best results so far…