Latest temperature series (week 1)
Last week a set of four wafers was processed at four different RTP temperatures (1000, 950, 900, 850 C). Unfortunately, the yield across these wafers was low due to possible metal contamination in the film and etch issues. However, the TEMs still show a range of porosities and pore sizes across the different thermal treatments.
This week, we deposited a repeat of this set to compare the consistency in film morphology over time (SC 257, 258, 263, 264). However, the newer set also appears to be contaminated (yield was higher, though). Once we have confirmed that the Cu has been eliminated, a new set will be run.