Assembly statistics for SiN wafers 1070 and 1081
I’ve been on a Sepcon assembly binge, and I thought I would post my assembly statistics.
On 12/15/13 (assembly “L”) I broke 28 chips out of wafer 1070. 3 chips were visually damaged by the break-out process, 1 was already defective. After inserting the chips into the sepcon housing, testing with 5 psi nitrogen revealed 6 more were broken (this meant their permeance as measured by the mysterious green flow meter was at least 4 units higher than the average permeance). During the course of experiments, one chip did not pass any water and one chip flowed water much too fast. Stats: 1 hr 40 min for 18 tested chips (including the two that failed during experiments) from 28 starting chips.
12/16/13 (assembly “M”) wafer 1070. After breakout I lightly tapped the tweezers holding the chips so that breakout dust would be knocked off the freestanding membranes before assembly (thanks Josh for the suggestion). 5 chips were damaged by breakout or were already defective. 2 failed during nitrogen testing. During experiments 3 chips failed to flow water, one had unusually high water flow. Stats: 1 hr 8 min for 16 tested chips (including the four that failed during experiments) from 23 starting chips.
12/16/13 (assembly “N”) wafer 1081. 6 damaged by breakout/defective. 4 failed during nitrogen testing. No experiments have been done. Stats: 1 hr 41 min for 23 tested chips from 33 starting chips.
12/18/13 (assembly “O”) wafer 1070. 6 damaged by breakout/defective (lots of defective ones this time). 3 failed during nitrogen testing (average permeance ~3 units). No experiments have been done. Stats: 1 hr 11 min for 15 tested chips from 24 starting chips.
All chips came from this hole:
I don’t know if these values are reasonable, or if the statistics I’m presenting are the ones we care about, or if this is the best place to put this. But I’m sure this is worth discussing.