Uniformity!

Wafer 403 was processed last week using the new thermal oxide/TEOS steps outlined in the previous posts. I took images from six positions at different radial positions on different axis. All six samples looked relatively uniform!

(1,0) – 35kx

(0,-2) – 35kx

(3,0) – 35kx

(4,0) – 35kx

(0,5) – 35kx

We know that the thermal oxide is more uniform/dense than a sputtered oxide. Was this enough to bring our uniformity in? The next challenge is to eliminate the copper contamination and pinhole defects…

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