Here are the first experiments I have performed with the SepCon slots, under the guidance of Jamie and Kilean. The goal of these experiments is to prove that goat anti-human beads (6.8 um diameter) can be combined with a low concentration of Human IgG (1 mg/mL) which will cause aggregation, and therefore accumulate on the…
160112 LO Grant Update
Power Point for my Senior Design https://docs.google.com/file/d/0B1AH05-mf_tQLTdSMHRWX0NjNGc/edit?usp=sharing
For this experiment, 3um diameter pores were created using SimPore’s mask. Reactive Ion Etching was used to form the pores in the SiN. Both 25nm and 150nm TEOS oxides were used. An SU8 Structure of 10um lines with 100um square windows was chosen. A sample was placed in 10:1 BOE w/ surfactant for various amounts…
Etch Rate in BOE 10:1 Thermal Oxide TEOS PECVD Oxide LTO Sputtered 10:1 BOE at 20C 66 nm/min 266.4 nm/min > 180 nm/min * Each oxide type was placed in BOE w/ surfactant for 10 seconds, then the rate per minute was determined. *after 10 seconds no oxide remained on LTO sample therefore the exact…
New Lift-off setup, thanks to suggestions and concerns about flatness of the membrane after lift-off. Floating SU8 – SiN membrane with superstructure submerged. Membrane after removal from water Membrane, dry on first version of lift-off super structure. Membrane after separation. SiN has adhered to the superstructure and the SU8 peeled off the top. The…
Using the same successful procedure as the last lift-off attempt, another large piece of membrane lifted off. This came from the same wafer, but confirms that 30 minutes in BOE is sufficient to etch 25 nm of thermal oxide under the SU8 structure. Ideally this time can be reduced by means of a different sacrificial…
Using a wafer with a stack of Si-25nm(thermOx)-40nm(SiN)-50nm(PNCSi), lift-off was achieved on a small scale. First the SiN was etched using the standard process Simpore has developed, this also removed most/all of the PNCSi. The standard uChem process was then followed for SU8 application. A negative mask with 10um lines and 50um spaces was chosen…
SU-8 3010 (MicroChem) was chosen for its improved adhesion strength, and reduced stress. MicroChem also provides a datasheet on the usage of this negative resist that was followed as a baseline. For Post Exposure Bake (PEB) two methods were implemented, standard procedure, and part of Li, et al process: 55C for 2 hours to reduce…
The goal of this project is to determine the viability of PEG as a structural support for large area nano porous membranes. This would enable lift-off vs. the current method of etching through the wafer. The ideal properties are that the structure can withstand an aqueous solution for many days without peeling off or dissolving,…