Process Flows

What process flows have I used to create my devices?

Standard

1. Cut out gaskets (10 min)
2. Embed Electrode (face down) (3 hrs)
3. Ozone Bottom, Interstitial, Filter and Top channels together (1 hrs, cure overnight)
4. Ozone Bottom Electrode (1 hr, cure overnight)
5. Ozone Top Electrode + Feet (1 hr, cure overnight)

Weaknesses are that there are leaks between the electrodes and the channel gaskets because of PDMS sheeting over the electrical face -> short circuit.

Strengths are that it protects the Filter well. The silicone can wrap around the filter to make a seal.

Alternative #1

1. Cut out gaskets (10 min)
2. Embed Electrode (flip-chip) (3 hrs)
3. Ozone Bottom Electrode to Bottom Channel and Top Electrode to Top Channel (vacuum seal) (1hr)
4. Ozone Filter and Interstitial to BottomElectrode/Channel (vacuum seal) (1hr)
5. Ozone Top Electrode/Channel (vacuum seal) (1 hr)
6. Ozone Feet (vacuum seal)

Weaknesses are that it broke the electrodes at step 5 due to the overhang. It also caused leaks in the interstitial layer due to compression.
New Bonding Process

1. Cut out gaskets (10 minutes)
2. Embed e