Updated Burst Pressures Picture

Wafers 525 & 527 have a 1000 Å dry thermal oxide mask with all three films on the frontside sputtered. Both these wafers had a high density of pinholes. The pores are also irregular in shape and seem to have material “hanging” off the edges of the pores. Could this be a consequence of depositing…

This previous post contrasted how gold could be separated by pressure in deionized water, but not by diffusion (w199).  I checked up on that diffusion sample again after 6 days, and while the retentate had mostly evaporated, there was no gold within the remaining filtrate. As you may recall, there has been some discrepency with…

JP handed me a stack of wafers today, and I went over to the Krauss Lab and with the help of Jack Calcines got some AFM images.  I didn’t have much time to play with, so I tried to get the most data I could quickly.  I think we’ll have to do a more exhaustive…

In Nottingham this summer, I attempted to use a Makerbot2 printer to create culture devices for SEPCON chips. I had varying degrees of success, but I was not able to get a good seal between the PLA and gaskets using only machined grooves. This would have limited our ability to do TEER and other 2-chamber…

I tested those membranes from w335 and w341 with approximately 40 nm of deposited oxide on both sides for air permeability and burst pressures. There was tiny amount of air flow (I checked for leak) from few of them which I didn’t expect with such thick oxide. The burst pressures are higher then without the…