Shear Free Chemotaxis Manuscript (Submitted to LOC)

Bob and I are trying to determine which wet etch would be appropriate to use to remove the native oxide inside the pores before membrane liftoff. The issue is when removing the native oxide, we will remove part of the membrane. So far, we removed native oxide from bare silicon wafers using 50:1 HF. For…

I posted previously about an issue we have with needing to strip the native oxide from the sacrificial silicon layer prior to performing the through-pore etch with XeF2 that enables separation of the oxide membrane from the wafer substrate.  The issue is that the membrane is generally attacked by whatever etch method is used to…

Previous posts: Anodic Bonding Theory, Anodic Bonding Setup   I had originally hoped there would be enough residual impurity in the oxide layer to create a direct bond with Vincent’s chips. This was a foolish hope. Pyrex is at least 4-5% doping and standard p-doped silicon wafers are 5-6 orders of magnitude less than that, with…

In my 1st post detailing glial cells on pnc-Si transwells, I saw lots of cell clumps above the membrane window (see here).  Since these cells were grown in the wells, I thought they could be piling on top of each other in the wells and getting trapped.  Here, I decided to flip the sample so…

In this post, we’ll discuss a little bit about how would the deposition temperature affect the pore formation and pore morphology. I first show some previous results of the effect of deposition temperature on the porosity and pore size from Dave. From this plot, it shows that the relative low deposition temperature barely affects the…