Burst Pressure Vs. Temperature of Deposition
Dave deposited a series of wafers last week at different temperatures. SC 166 -SC 173 were deposited between RT and 300C.
These wafers had Jess’ E.O mask pattern ( circular sepcon) with single , 3,6 and 9 squares. The wafers were mostly pinhole free.In order to determine if deposition temperature affected the nature/ strength of the membranes, burst pressure tests were carried out on these wafers.
All formats of chips were tested and most of the tested membranes had 1-2 pinholes. Pinhole samples were tested in order to save valuable samples for Jess’ diffusion experiments.
The graph of Burst Pressures vs Temperature was plotted for different squares in order to see if there was any corelation.
No corelation between the temperature of deposition and the burst pressure could be deduced from the graph. This could be a result of small sample size or the lack of any realtionship b/w deposition and strength of membrane.