Last week, we created a series of wafers that were RTPed at four different temperatures between 900 C and 1000 C. Below is a comparison of the 900 C (left) vs. 1000 C RTP (right) wafer.
We see that a difference of 100 C shifts the cutoff ~10 nm. The pores are also the roundest I’ve seen in a while. Pinhole density on these two wafers was moderate but we should be able to salvage some defect-free chips for Jess’ separation work.
http://www.azonano.com/news.aspx?newsID=26865
The Institute of Optics, University of Rochester University of Rochester, Rochester, NY Ph.D. Public Defense Interaction of Light with Metallized Ultrathin Silicon Membrane Krishanu Shome Advisor: Professor Philippe M. Fauchet Wednesday, February 27, 2013 Time 9:00 a.m. Place Wilmot 116 Freestanding metallized structures, a few tens of nanometer thick, show promise in creating flow-through sensors,…
I have been having problems getting smoothed sheets of nanomembrane on my little oxide structures. I tried a number of different ways to delaminate the membrane, using tweezers to poke the membrane especially, but had little success getting smoothed sheets. I tried compressing the two chips together using the burst pressure clamp, then poking it…
I carried out the bead assay to monitor membrane integrity in Sepcon format. The sample (no RTP) was taken from #703 and put in DMEM(-FBS) @ RT with membrane side facing up. 15um polystyrene beads were allowed to settle on the membrane and images were taken. As can be seen, the membrane is still intact…
Comments are closed.
Fantastic! Very close to what we were hoping for in pore sizes and great looking material. Burst tests please!
What wafer numbers are these?
It says 670 and 673 on the images.