Porous TEM windows fabrication using CsCl self-assembly

I got some new data on the pnc-Si capacitive sensor that has not been published on the blog yet. All of the results are summarized in the Spring MRS Proceedings paper mrsspring09_kavalenka. I also uploaded presentation that I made on MRS in “Presentations ” section of the blog. I will talk more about this data…

The mechanism of organic dye photobleaching is not well understood, but there are a few methods out there for reducing the rate of photobleaching.  Some literature suggests that photobleaching is due to excess oxygen in solution and the interaction between the dye and oxygen radicals.  Actin research swears by the following “anti-bleaching buffer” to limit…

In the previous post, I used a compound error bar that took into account both image and operator variability. While that seemed to make things a little better, we were still having a problem with w705. I reprocessed a couple extra images from the TEM gallery, and added the differences to the image variability part…

I’ve recently been exploring hydraulic permeability using the pressure cell.  As you may recall, the majority of our permeability measurements have been done in the centrifuge (EQ format or closed bucket).  The pressure cell allows for a more accurate measurement of permeability because it is not affected by changing water levels or variable driving pressures….

Below are results for air permeability tests I took on wafers w302, w304, w187, w189, w310. The X axis is the position of a sample on the wafer (from inside to outside).Samples form wafer 189 passed no air and the permeability of wafer 187 is extremely low.Permeability of other wafers increases closer to the outer…

Vincent has asked us to integrate our nanoporous filter on top of a thin layer of silicon nitride, so that he can clean up his analyte before being exposed to his single nanopore (fabricated using a dielectric breakdown). There are many different ways to join silicon wafers together. Specifically, we wish to create the following…