Uniformity!
Wafer 403 was processed last week using the new thermal oxide/TEOS steps outlined in the previous posts. I took images from six positions at different radial positions on different axis. All six samples looked relatively uniform!
(1,0) – 35kx
(0,-2) – 35kx
(3,0) – 35kx
(4,0) – 35kx
(0,5) – 35kx
We know that the thermal oxide is more uniform/dense than a sputtered oxide. Was this enough to bring our uniformity in? The next challenge is to eliminate the copper contamination and pinhole defects…
Thats great, Dave. Nice job materials people.
Bravo!