As a continuation to my previous post, I am running a triplicate of cell culture adhesion tests to observe cell lose on our membranes following physiological shear stress.
HUVECs (P3,4,5) were seed within our mimetic and left to grow to confluent for 24 hours. Shear (4.5 dyn/cm2) was initiated and images were collected following 5 hours.
I recently received wafer 567 from Dave for cell culture work. It has many intact membranes but is riddled with pinholes, having only 3 pinhole-free samples. I decided to test them for air permeability and burst pressure, shown below. I also noticed some odd features on the membrane and surrounding Si. They are circular but…
We’ve completed two successful 4-hour small animal hemodialysis experiments. I’ve also analysed the serum from all previous experiments. This graph shows only the recently analysed serum and doesn’t include the previously analyzed data. I’ll give a more detailed analysis of these results when we finish the next two animals, mid April. I’m in the midst of submitting…
UPDATED 12/12/07 – Added data on albumin. In these gels, the band from beta-galactosidase appears to overlap with phosphorylase b making it difficult to determine which protein passes and which is retained. I have used Mike Bindschadler’s pore imaging software to find the pore sizes of the three membranes I have use to perform succesful…
Two years ago (blog post), I asked Professor McAleavey to help me see if we could use NPN chips to generate ultrasound. I’d found a paper (An exact solution of AC electro-kinetic-driven flow in a circular micro-channel) that suggested, given the geometry of our chips, that if the chips could be used to generate sound, they’d…
In my last post, I concluded that switching the o-ring position from below the membrane to the top in the sepcon produced no leaks. The reason for this switch was to reduce the 1mm “dead-space” (created by the o-ring) that adds to the unstirred water layer (UWL). The next thing that Barrett and I looked…
We have a wafer that did not clear 500 nm pores (400 nm thick silicon nitride, #4682). There are about 230 chips that could be useful if they were etched a little. I used a SF6 based recipe (15 sccms O2, 30 sccms SF6, 10 sccms CHF3, 110/10 W FWD/REF power, 5e-5 torr base pressure,…