Resistance of coated membrane cells
Samples are from wafers #316 and 318. This is the first time for wafer scale deposition.
Processing conditions:
1) chamber base pressure @ 6×10-7 Torr (previously @ 5×10-6 Torr)
2) 15nm Ti + 15nm Au, no vacuum break
Estimated “cell resistance”: about 20-25 ohm, much lower than previous measurement.
Possible reasons why lower resistance is observed:
1) “Au on top of Ti” vs. “Ti only”
2) better processing pressure resulting in much better film quality
Please design another experiment that will let you confirm why these samples have much lower resistance. The more continuous gold will certainly help…