Nanoporous SiN Lift-Off Update – April 2015
Background Details: Josh Miller & I have made some recent progress in the NPN LO work. We had several ø6″ wafers w/ 100 nm of thermal oxide processed by Rogue Valley, wherein they deposited 650 nm of poly-Si (LP-CDV) followed by 50 nm of low-stress SiN (LP-CVD). Josh added the a-Si + SiO2 layers at…