Liquid Silanization again
A bunch of samples from W683 (no RTP) were liquid silanized and used in 3D format to track discoloration in comparison to control sample, in DMEM(-FBS) @ 37C in Oven.
I used all the cracked chips which broke while clamping them into Sepcons. Instead of tossing them off, I just wanted to repeat the discoloration experiment with these samples.
As expected and seen before, the silanized samples discolor much later than the non-silanized one which started in ~5 hours. I also kept two samples alongwith some ground wafer to see if this slows down or accelerates the discoloration process (In Barrett’s recent post, we see that keeping ground up wafer slows down the process.)
The chips were all broken, so silanization might not have been effective. Though there is one sample which hasn’t discolored after 11 hours. Samples with ground up wafer don’t show any significant difference in above figure.
All these samples have their membrane side down, but in case of cell culture we would like to have the membrane side up. Hence, I will have to check how long does silanized sample last in Sepcon with its membrane side up. (Its been observed before that ‘membrane side up’ sample discolors faster than ‘membrane side down’ sample in a Sepcon.)
Next, I need to coat the samples with other proteins like fibronectin and collagen to see their effects. Moreover, there is a need to get our old friend ‘RTP’ back and check ‘Sepcon+RTP’ life period.

I’m a little confused about the process in this one. Is this correct:
1. You silanized all the chips.
2. You put them into sepcons.
3. They broke in the sepcon.
4. Were they removed from the sepcon for discoloration experiments or were they not so badly cracked that they could stay in the sepcon? Or did they break when you tried to remove them for this picture??
I ask because there’s still a really good block of the ablation by the o-ring.
They broke when I was clamping them in Sepcon but I let them still stay there and carried out the discoloration experiments, after which I cut open the Sepcon to take out the broken chip (in pieces). Then I solve the puzzle of getting the broken pieces together to take the picture.
Yes, the o-ring ablation is still there since when in Sepcon, the chip just has a crack across it, but is still pretty firmly clamped.